Surface-mount technology
Surface-mount technology (SMT), originally called planar mounting, is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). An electrical component mounted in this manner is referred to as a surface-mount device (SMD). In industry, this approach has largely replaced the through-hole technology construction method of fitting components, in large part because SMT allows for increased manufacturing automation which reduces cost and improves quality. It also allows for more components to fit on a given area of substrate. Both technologies can be used on the same board, with the through-hole technology often used for components not suitable for surface mounting such as large transformers and heat-sinked power semiconductors.
- Comment
- enSurface-mount technology (SMT), originally called planar mounting, is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). An electrical component mounted in this manner is referred to as a surface-mount device (SMD). In industry, this approach has largely replaced the through-hole technology construction method of fitting components, in large part because SMT allows for increased manufacturing automation which reduces cost and improves quality. It also allows for more components to fit on a given area of substrate. Both technologies can be used on the same board, with the through-hole technology often used for components not suitable for surface mounting such as large transformers and heat-sinked power semiconductors.
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- enSurface-mount technology (SMT), originally called planar mounting, is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). An electrical component mounted in this manner is referred to as a surface-mount device (SMD). In industry, this approach has largely replaced the through-hole technology construction method of fitting components, in large part because SMT allows for increased manufacturing automation which reduces cost and improves quality. It also allows for more components to fit on a given area of substrate. Both technologies can be used on the same board, with the through-hole technology often used for components not suitable for surface mounting such as large transformers and heat-sinked power semiconductors. An SMT component is usually smaller than its through-hole counterpart because it has either smaller leads or no leads at all. It may have short pins or leads of various styles, flat contacts, a matrix of solder balls (BGAs), or terminations on the body of the component.
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- Method
- Is primary topic of
- Surface-mount technology
- Label
- enSurface-mount technology
- Link from a Wikipage to an external page
- www.marsport.org.uk/smd/mainframe.htm
- elektronik.googlecode.com/files/SMD_Catalog222.pdf
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- Albedo
- Automated optical inspection
- Ball grid array
- Board-to-board connector
- Breadboard
- Breakout board
- Category:Chip carriers
- Category:Electronic design
- Category:Electronics manufacturing
- Chip carrier
- Conformal coating
- Convection
- Copper
- Deionized water
- E96 Series
- Electromagnetic compatibility
- Electronics
- Electronics manufacturing services
- Ferrite core
- File:Juki KE-2080L by Megger.jpg
- File:RC2010JK-071K2L.jpg
- File:SMD capacitor.jpg
- File:SMDcompared.jpeg
- File:SMT-Bestueckung.jpg
- File:Smt closeup.jpg
- File:SMT sizes, based on original by Zureks.svg
- File:Soldering a 0805.jpg
- Film capacitor
- Flash point
- Fluorocarbon
- Flux (metallurgy)
- Glue
- Hydrocarbon
- IBM
- In-circuit test
- Infrared
- Inkjet printer
- IPC (electronics)
- JEDEC
- Lead (electronics)
- Limonene
- List of electronics package dimensions
- List of integrated circuit packaging types
- Logo
- Microhenry
- Nanohenry
- Nitrogen
- Numerical control
- Plastic leaded chip carrier
- Point-to-point construction
- Potting (electronics)
- Printed circuit board
- Reflow oven
- Reflow soldering
- RKM code
- RoHS
- Rosin
- Saturn IB
- Saturn Launch Vehicle Digital Computer
- Saturn V
- Saturn V Instrument Unit
- Screen printing
- Selective soldering
- SMT placement equipment
- Solder ball
- Soldering iron
- Solder paste
- Stripboard
- Surface tension
- Through-hole technology
- Tin
- Wave soldering
- Wire wrap
- SameAs
- 4132685-4
- 4248071-1
- Composant monté en surface
- Công nghệ dán bề mặt
- Jcyz
- m.01hsjk
- Montaż powierzchniowy
- Oppervlakmontering
- Overflademonteringsteknologi
- Overflatemontering
- Paviršinis montavimas
- Pindmontaažikomponent
- Pintaliitos
- Povrchová montáž
- Q12740266
- Q191042
- SMD
- SMD
- SMT (výroba elektroniky)
- Surface-mounted device
- Surface-mounted device
- Surface-mount technology
- Surface-mount technology
- Surface-mount technology
- Tecnologia a montaggio superficiale
- Tecnologia de montagem superficial
- Tecnología de montaje superficial
- Tecnologia de muntatge superficial
- Ytmontering
- Yüzey montaj teknolojisi
- Поверхневий монтаж
- Поверхностный монтаж
- СМД технологија
- טכנולוגיית השמה משטחית
- تقانة التركيب السطحي
- فناوری نصب-سطحی
- தள-ஏற்றத் தொழில்நுட்பம்
- 表面安装技术
- 表面実装
- 표면 실장 기술
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- Category:Chip carriers
- Category:Electronic design
- Category:Electronics manufacturing
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- Surface-mounted device
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- Wikipage page ID
- 232333
- Wikipage revision ID
- 1115465290
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- Template:Electronic components
- Template:Main
- Template:Nbsp
- Template:Portal
- Template:Reflist
- Template:Semiconductor packages
- Template:Short description
