Ball grid array
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The traces connecting the package's leads to the wires or balls which connect the die to package are also on average shorter than with a perimeter-only type, leading to better performance at high speeds.
- Comment
- enA ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The traces connecting the package's leads to the wires or balls which connect the die to package are also on average shorter than with a perimeter-only type, leading to better performance at high speeds.
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- Has abstract
- enA ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The traces connecting the package's leads to the wires or balls which connect the die to package are also on average shorter than with a perimeter-only type, leading to better performance at high speeds. BGAs were introduced in the 1990s and became popular by 2001. Soldering of BGA devices requires precise control and is usually done by automated processes such as in computer-controlled automatic reflow ovens.
- Hypernym
- Packaging
- Is primary topic of
- Ball grid array
- Label
- enBall grid array
- Link from a Wikipage to an external page
- amkor.com/packaging/laminate/pbga/
- c44f5d406df450f4a66b-1b94a87d576253d9446df0a9ca62e142.ssl.cf2.rackcdn.com/2015/03/PBGA-J-Devices-DSJD401.pdf
- Link from a Wikipage to another Wikipage
- Altera
- Amkor Technology
- Boundary scan
- Category:Chip carriers
- Category:Electronic component distributors
- Celeron
- Chip carrier
- Do it yourself
- Dual in-line package
- Dye
- Dye-and-Pry
- Embedded wafer level ball grid array
- File:BGA joint xray.jpg
- File:BGA RAM.jpg
- File:Bga und via IMGP4531 wp.jpg
- File:Celeron mobile.jpg
- File:NVIDIA@220nm@Fixed-pipline@NV10@GeForce 256@T5A3202220008 S1 Taiwan A DSC01376 (29588383793).jpg
- File:Solder ball grid.jpg
- Flip chip
- Grid pattern
- Head in pillow (metallurgy)
- Heat gun
- Inductance
- Industrial CT scanning
- Infrared heater
- Integrated circuit
- Interposer
- JEDEC
- JTAG
- Land grid array
- Maker culture
- Micro-FCPGA
- Microprocessor
- Multi-chip module
- Original equipment manufacturer
- Package on package
- Pad cratering
- Pentium II
- Pentium III
- Pin grid array
- Printed circuit board
- Quad-flat no-leads package
- Quad Flat Package
- Reflow oven
- Rework (electronics)
- Rework station
- RoHS compliant
- Small-outline integrated circuit
- SMT placement equipment
- Solder ball
- Solder bridging
- Stiffness
- Surface-mount
- Surface tension
- System-on-a-chip
- Thermal expansion
- Thermal resistance
- Thermocouple
- TQFP
- Whisker (metallurgy)
- X-ray
- ZIF socket
- SameAs
- 4m3Ts
- Ball grid array
- Ball grid array
- Ball grid array
- Ball grid array
- Ball grid array
- Ball grid array
- Ball Grid Array
- Ball Grid Array
- Ball Grid Array
- BGA
- BGA
- BGA
- m.01hn35
- Matrice de billes
- Q570628
- آرایه مشبک توپی
- شبكة كرات مصفوفة
- பந்தணி
- 球柵陣列封裝
- 볼 그리드 배열
- Subject
- Category:Chip carriers
- Thumbnail
- WasDerivedFrom
- Ball grid array?oldid=1121738378&ns=0
- WikiPageLength
- 16760
- Wikipage page ID
- 231291
- Wikipage revision ID
- 1121738378
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