| 46016 |
Creator |
c3baa1aae2495d9fcf383c433b46bfe0 |
| 46016 |
Creator |
ext-42f6da4c045a73512a8e0864b7fd4c3d |
| 46016 |
Creator |
ext-0c438fad62ddac9a0af6ea0795747cb5 |
| 46016 |
Creator |
ext-9836d72ad20ef1e61189679e62b73d36 |
| 46016 |
Creator |
ext-e035166d2aef4b25b2e2998d249a67d8 |
| 46016 |
Date |
2015-05-19 |
| 46016 |
Is Part Of |
repository |
| 46016 |
abstract |
The thermal cycling reliability of candidate copper and aluminium power substrates
has been assessed for use at temperatures exceeding 300°C peak using a combination
of thermal cycling, nanoindentation and finite element modelling to understand the
relative stresses and evolution of the mechanical properties. The results include
the relative cycling lifetimes up to 350°C, demonstrating almost an order of magnitude
higher lifetime for active metal brazed Al / AlN substrates over Cu / Si<sub>3</sub>N<sub>4</sub>,
but four times more severe roughening and cracking of the Ni-P plating's on the Al
/ AlN (DBA) substrates. The nonlinear finite element modelling illustrated that the
yield strength of the metal and the thickness of the ceramic are the main stress controlling
factors, but comparisons with the cycling lifetime results demonstrated that the fracture
toughness (resistance) of the ceramic is the over-riding controlling factor for the
overall passive thermal cycling lifetimes. In order to achieve the highest substrate
lifetime for the highly stressed high temperature thermal cycled applications, the
optimum solution appears to be annealed copper, brazed on to a thicker than normal
or higher fracture toughness Si<sub>3</sub>N<sub>4</sub> ceramic. |
| 46016 |
authorList |
authors |
| 46016 |
presentedAt |
ext-4b4782ace13874022f01836da47bc9f4 |
| 46016 |
status |
peerReviewed |
| 46016 |
uri |
http://data.open.ac.uk/oro/document/430098 |
| 46016 |
uri |
http://data.open.ac.uk/oro/document/430100 |
| 46016 |
uri |
http://data.open.ac.uk/oro/document/430105 |
| 46016 |
uri |
http://data.open.ac.uk/oro/document/430106 |
| 46016 |
uri |
http://data.open.ac.uk/oro/document/430107 |
| 46016 |
uri |
http://data.open.ac.uk/oro/document/430108 |
| 46016 |
uri |
http://data.open.ac.uk/oro/document/434681 |
| 46016 |
type |
AcademicArticle |
| 46016 |
type |
Article |
| 46016 |
label |
Hamilton, Dean P.; Mills, Liam; Bowen, James ; Jennings, Michael R. and Mawby,
Philip A. (2015). High temperature reliability of power module substrates. In:
PCIM Europe 2015, 19-20 May 2015, Nuremburg, Germany. |
| 46016 |
label |
Hamilton, Dean P.; Mills, Liam; Bowen, James ; Jennings, Michael R. and Mawby, Philip
A. (2015). High temperature reliability of power module substrates. In: PCIM Europe
2015, 19-20 May 2015, Nuremburg, Germany. |
| 46016 |
Title |
High temperature reliability of power module substrates |
| 46016 |
in dataset |
oro |