Land grid array
The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket (when a socket is used) rather than the integrated circuit. An LGA can be electrically connected to a printed circuit board (PCB) either by the use of a socket or by soldering directly to the board.
- Comment
- enThe land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket (when a socket is used) rather than the integrated circuit. An LGA can be electrically connected to a printed circuit board (PCB) either by the use of a socket or by soldering directly to the board.
- Depiction
- Has abstract
- enThe land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket (when a socket is used) rather than the integrated circuit. An LGA can be electrically connected to a printed circuit board (PCB) either by the use of a socket or by soldering directly to the board.
- Hypernym
- Packaging
- Is primary topic of
- Land grid array
- Label
- enLand grid array
- Link from a Wikipage to an external page
- www.techpowerup.com/%3F12088
- web.archive.org/web/20070907023913/http:/www.theinquirer.net/%3Farticle=31787
- Link from a Wikipage to another Wikipage
- Alder Lake (microprocessor)
- AMD
- Ball grid array
- Broadwell-E
- Category:Chip carriers
- Chip carrier
- Coffee Lake
- CPU socket
- Dual in-line package
- Epyc
- File:Intel CPU Pentium 4 640 Prescott bottom.jpg
- File:Prozessormontage LGA 1155 imgp2112 smial wp.webm
- File:Sockel 775.jpg
- Haswell-E
- Hewlett-Packard
- Integrated circuit
- Intel
- Intel C612
- Intel Core
- Intel Core 2
- Intel Core i7
- Intel X99
- Kaby Lake
- Kaby Lake-X
- LGA 1150
- LGA 1151
- LGA 1155
- LGA 1156
- LGA 1200
- LGA 1356
- LGA 1366
- LGA 1700
- LGA 2011
- LGA 2011-3
- LGA 2066
- LGA 3647
- LGA 4189
- LGA 771
- LGA 775
- MIPS architecture
- Motherboard
- Opteron
- PA-8000
- Pentium
- Pentium 4
- Pentium D
- Pin grid array
- Printed circuit board
- R10000
- Skylake (microarchitecture)
- Skylake-X
- Socket AM5
- Socket C32
- Socket F
- Socket G34
- Socket SP3
- Socket sTRX4
- Socket TR4
- Soldering
- Sun Microsystems
- Surface-mount
- UltraSPARC II
- X299
- Xeon
- SameAs
- Land grid array
- Land grid array
- Land grid array
- Land grid array
- Land Grid Array
- Land Grid Array
- Land Grid Array
- Land Grid Array
- Land Grid Array
- LGA
- LGA
- LUTR
- m.03dr1t
- Matrice de pastilles
- Q130913
- آرایه مشبک کفه
- شبكة سطوح مصفوفة
- 平面网格阵列封装
- 랜드 그리드 배열
- Subject
- Category:Chip carriers
- Thumbnail
- WasDerivedFrom
- Land grid array?oldid=1120701250&ns=0
- WikiPageLength
- 7730
- Wikipage page ID
- 812453
- Wikipage revision ID
- 1120701250
- WikiPageUsesTemplate
- Template:Refimprove
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- Template:Semiconductor packages
- Template:Short description
